Semiconductor device and manufacturing method thereof

ABSTRACT

A semiconductor device includes: a semiconductor substrate; a pair of first diffusion layer regions provided near a top face of the semiconductor substrate; a channel region provided between the first diffusion layer regions of the semiconductor substrate; a gate insulation film provided on the channel region and on the semiconductor substrate such as to overlap with at least part of the first diffusion layer regions; a gate electrode provided on the insulation film; a pair of silicon selective growth layers provided on the semiconductor substrate at both sides of the gate electrode, each of the pair of silicon selective growth layers overlapping with at least part of the first diffusion layer regions, and being provided at a distance from the gate electrode; second diffusion layer regions provided in each of the silicon selective growth layers, peak positions of impurity concentration of the second diffusion layer regions being shallower than bottoms of the silicon selective growth layers; and third diffusion layer regions provided near side faces of the silicon selective growth layers, and electrically connecting the first diffusion layer regions to the second diffusion layer regions.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device including a MOS-type transistor and a manufacturing method thereof. The present invention particularly relates to a semiconductor including a MOS-type transistor in which silicon selective growth layers including impurity diffusion layers are provided in a step-like (elevated) shape on both sides of a gate electrode, and a manufacturing method thereof.

Priority is claimed on Japanese Patent Application No. 2007-182359, filed Jul. 11, 2007, the content of which is incorporated herein by reference.

2. Description of Related Art

In MOS-type transistors, the short channel effect must be suppressed to achieve miniaturization, i.e. to shorten the gate length. To reduce the junction depth of the source and drain regions (depth from the substrate surface) and suppress reduction of the on-current, resistance must be suppressed.

To meet such demands, a transistor with an elevated source/drain structure, in which a step-like (elevated) silicon selective growth layer is provided in a source region and a drain region of a silicon substrate, is proposed (e.g. Japanese Unexamined Patent Application, First Publication No. H 10-50989, Japanese Unexamined Patent Application, First Publication No. 2000-49348, Japanese Unexamined Patent Application, First Publication No. 2004-6891). In such transistors, when fabricating the source region and the drain region, ions are implanted from a top face of the silicon selective growth layer. This enables the source and drain regions to be fabricated thinner by the same thickness as the silicon selective growth layer, while utilizing conventional ion-implantation conditions. A transistor in which short channel effect is unlikely to arise can thus be obtained. It also becomes possible to fabricate source and drain regions in a diffusion layer region of higher concentration, thereby reducing the parasite resistance and increasing the on-current.

FIG. 14 is an example of a transistor with an elevated source/drain structure of related art. The transistor in FIG. 14 is an n-channel transistor that uses electrons as carriers. In this transistor, a gate electrode 103 is formed over a p-type silicon substrate 101, with a gate insulation film 102 therebetween. An upper gate insulation film 104 is provided on a top face of the gate electrode 103. Side walls 105 made of insulation film are formed at side faces of the gate electrode 103.

Diffusion layer regions including first diffusion layer regions 106 a and 106 b to fourth diffusion layer regions 109 a and 109 b are provided respectively at both side faces of gate electrode formation regions (regions corresponding to gate electrodes) of the silicon substrate 101. The first diffusion layer regions 106 a and 106 b are n-type impurity diffusion layers, provided in regions that correspond to the side walls 105 of the silicon substrate 101. The first diffusion layer regions 106 a and 106 b function as extension regions that constitute a lightly doped drain (LDD) structure. In this transistor, a region between these first diffusion layer regions 106 a and 106 b becomes a channel region 110 which carriers flow through.

The fourth diffusion layer regions 109 a and 109 b are p-type impurity diffusion layers, provided around the first diffusion layer regions 106 a and 106 b and third diffusion layer regions 108 a and 108 b of the silicon substrate 101. The fourth diffusion layer regions 109 a and 109 b function as halo regions that prevent punch-through and the like. Step-like (elevated) silicon selective growth layers 110 a and 110 b are fabricated by selective epitaxial (EPI) growth on both sides of the gate electrode 103 (at regions corresponding to the third diffusion layer regions 108 a and 108 b) on the silicon substrate 101.

Second diffusion layer regions 107 a and 107 b are provided in approximately the whole of the silicon selective growth layers 110 a and 110 b. The second diffusion layer regions 107 a and 107 b are n-type impurity diffusion layers, and are electrically connected at underside edges to the first diffusion layer regions 106 a and 106 b of the same conductive type. The third diffusion layer regions 108 a and 108 b are provided in regions corresponding respectively to the silicon selective growth layers 110 a and 110 b of the silicon substrate 101. The third diffusion layer regions 108 a and 108 b are formed by diffusing the n-type impurities doped in the silicon selective growth layers 1 10 a and I lob into the silicon substrate 101.

FIG. 15 is an impurity concentration profile of this transistor taken along a line A3-A4 in FIG. 14. In FIG. 15, the horizontal axis represents distance from the top faces of the silicon selective growth layers 110 a and 110 b, and the vertical axis represents the impurity concentration. A position R1 of the silicon selective growth layer 110 b and a position R2 of the top face of the silicon substrate 101 are shown on the horizontal axis of FIG. 15. FIG. 15 indicates the impurity concentration S 1 of the first diffusion layer (n⁻ layer extension) region 106 b, the impurity concentration S2 of the second diffusion layer (n⁺ layer) region 107 b, the impurity concentration S3 of the third diffusion layer region 108 b, and impurity concentration S4 of the fourth diffusion layer (p-type Halo) region 109 b. Thus in this transistor, the impurity concentration S1 of the first diffusion layer regions 106 a and 106 b is lower than the impurity concentration S2 of the second diffusion layer regions 107 a and 107 b, and the impurity concentration S3 of the third diffusion layer regions 108 a and 108 b. The first diffusion layer regions 106 a and 106 b, the second diffusion layer regions 107 a and 107 b, and the third diffusion layer regions 108 a and 108 b constitute an LDD structure. That is, the second diffusion layer region 107 a and the third diffusion layer region 108 a, and the second diffusion layer region 107 b and the third diffusion layer region 108 b, which have high impurity concentration, respectively function as a source and a drain. The fourth diffusion layer regions 109 a and 109 b, which have low impurity concentration, function as extension regions.

The third diffusion layer regions 108 a and 108 b, which constitute a source and a drain, are formed by diffusion of n-type impurities doped in the silicon selective growth layers 110 a and 110 b into the silicon substrate 101. This enables the thickness (effective junction depth) of the third diffusion layer regions 108 a and 108 b to be thin. This transistor is therefore unlikely to suffer short channel effect Also, since the source and drain are constituted by the second diffusion layer regions 107 a and 107 b and the third diffusion layer regions 108 a and 108 b, their thicknesses become the total thicknesses of these diffusion layer regions, enabling resistance to be suppressed.

In this transistor, to achieve a reliable electrical connection between the first diffusion layer regions 106 a and 106 b and the second diffusion layer regions 107 a and 107 b, the impurity concentration of the portions of the second diffusion layer regions 107 a and 107 b that contact to the silicon substrate 101 (impurity concentration at point B in FIG. 15) must be high. However, when the impurity concentration at point B is high, more impurities are diffused to the silicon substrate 101, increasing the depth of the third diffusion layer regions 108 a and 108 b.

In miniaturizing the transistor, the side walls 105 provided on the side walls of the gate electrode 103 also becomes thinner. Consequently, the distance between the third diffusion layer region 108 a and the third diffusion layer region 108 b tends to decrease. In this circumstance, if the third diffusion layer regions 108 a and 108 b are fabricated to a deep position from the top face of the silicon substrate 101, short channel effect is likely to happen. This makes it difficult to shorten the gate length, i.e. to miniaturize the transistor. For this reason, the third diffusion layer regions 108 a and 108 b are generally designed to be fabricated at the minimum depth required for electrical connection between the first diffusion layer regions 106 a and 106 b and the second diffusion layer regions 107 a and 107 b.

However, the fourth diffusion layer regions 109 a and 109 b of the reverse-conductive type p-type) are generally provided below the first diffusion layer regions 106 a and 106 b and the third diffusion layer regions 108 a and 108 b. Therefore, if it is attempted to make the depth of the third diffusion layer regions 108 a and 108 b as shallow as possible, the p-type impurity in the fourth diffusion layer regions 109 a and 109 b cannot be repelled by the reverse-conductive impurity in the third diffusion layer regions 108 a and 108 b, leading to a high p-type impurity concentration at the interfaces between the fourth diffusion layer regions 109 a and 109 b and the third diffusion layer regions 108 a and 108 b. As a result, as indicated at point C in FIG. 15, a high-concentration pn junction is formed between the third diffusion layer regions 108 a and 108 b and the fourth diffusion layer regions 109 a and 109 b, and the junction capacity in the diffusion layer region greatly increases. This leads to a problem of signal delay in the circuit.

Due to the nature of fabricating diffusion layer regions, the size of the first diffusion layer regions 106 a and 106 b is determined by the width of the side walls 105. As already mentioned, when the side walls 105 become narrower as the transistor is miniaturized, the first diffusion layer regions 106 a and 106 b also become smaller. This lessens the effect of by the LDD structure, namely the electric field relaxation effect. Tis leads to a problem of reduced hot carrier (HC) immunity.

SUMMARY

The present invention seeks to solve one or more of the above problems, or to improve upon those problems at least in part.

In one embodiment, there is provided a semiconductor device that includes: a semiconductor substrate; a pair of first diffusion layer regions provided near a top face of the semiconductor substrate; a channel region provided between the first diffusion layer regions of the semiconductor substrate; a gate insulation film provided on the channel region and on the semiconductor substrate such as to overlap with at least part of the first diffusion layer regions; a gate electrode provided on the insulation film; a pair of silicon selective growth layers provided on the semiconductor substrate at both sides of the gate electrode, each of the pair of silicon selective growth layers overlapping with at least part of the first diffusion layer regions, and being provided at a distance from the gate electrode; second diffusion layer regions provided in each of the silicon selective growth layers, peak positions of impurity concentration of the second diffusion layer regions being shallower than bottoms of the silicon selective growth layers; and third diffusion layer regions provided near side faces of the silicon selective growth layers, and electrically connecting the first diffusion layer regions to the second diffusion layer regions.

In another embodiment, there is provided a semiconductor device manufacturing method that includes: forming first diffusion layer regions at a semiconductor substrate on which a gate electrode provided with a gate insulation film and an upper gate insulation film are formed, in regions corresponding to both sides of the gate electrode; forming side walls on side faces of the gate electrode; forming step-like silicon selective growth layers on the semiconductor substrate at both sides of the gate electrode such that the silicon selective growth layers are adjacent to the side walls; forming second diffusion layer regions having a same conductive type as the first diffusion layer regions at top faces of the silicon selective growth layers, such that at least peak positions of impurity concentrations of the second diffusion layer regions are shallower than bottoms of the silicon selective growth layers; removing at least part of the side walls to form gap sections along side faces of the silicon selective growth layers; and forming third diffusion layer regions having a same conductive type as the first and second diffusion layer regions near side faces of the silicon selective growth layers, via the gap sections.

In the semiconductor device, first diffusion layer regions provided at respective sides of a gate electrode formation region of the semiconductor substrate function as extension regions of LDD structure. Second diffusion layer regions function as a source and a drain of the LDD structure. Third diffusion layer regions have a function of electrically connecting the first diffusion layer regions to the second diffusion layer regions.

According to the semiconductor device, the distance between the second diffusion layer regions which function as a source and a drain and the edge of the gate electrode can be made wider than the side wall formed in the manufacturing process, irrespective of the width of the side wall. Therefore, even when the width of the side wall is reduced to miniaturize the transistor, a sufficient distance between the source and the drain can be maintained. This makes short channel effect unlikely. Therefore, the gate length can easily be made shorter, which is effective in miniaturizing the transistor.

Further, according to the semiconductor device, the distance between the source and drain (second diffusion layer regions) and the edge of the gate electrode can be made wider. This can relax the electric field near the drain, and obtain excellent HC immunity.

BRIEF DESCRIPTION OF THE DRAWINGS

The above features and advantages of the present invention will be more apparent from the following description of certain preferred embodiments taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a vertical cross-sectional view of a semiconductor device according to a first embodiment;

FIG. 2 is a schematic view of one example of an impurity concentration profile taken along a line A1-A2 of FIG. 1, in the semiconductor device according to the first embodiment;

FIG. 3 is a vertical cross-sectional view of a step sequence in a manufacturing method of the semiconductor device according to the first embodiment, and illustrates steps of forming a lower gate insulation film, a gate electrode, and an upper gate insulation film;

FIG. 4 is a vertical cross-sectional view of a step sequence in the manufacturing method of the semiconductor device according to the first embodiment, and illustrates steps of forming first diffusion layer regions and fourth diffusion layer regions;

FIG. 5 is a vertical cross-sectional view of a step sequence in the manufacturing method of the semiconductor device according to the first embodiment, and illustrates steps of forming second diffusion layer regions;

FIG. 6 is a vertical cross-sectional view of a step sequence in the manufacturing method of the semiconductor device according to the first embodiment, and illustrates steps of forming third diffusion layer regions.

FIG. 7 is a vertical cross-sectional view of a semiconductor device according to a second embodiment;

FIG. 8 is a vertical cross-sectional view of a semiconductor device according to a third embodiment;

FIG. 9 is a vertical cross-sectional view of a step sequence in a manufacturing method of the semiconductor device according to the third embodiment, and illustrates a state before formation of first to third diffusion layer regions;

FIG. 10 is a vertical cross-sectional view of a semiconductor device according to a fourth embodiment;

FIG. 11 is a vertical cross-sectional view of a step sequence in a manufacturing method of a semiconductor device according to a fourth embodiment, and illustrates a state before formation of first to third diffusion layer regions;

FIG. 12 is a vertical cross-sectional view of a semiconductor device according to a fifth embodiment;

FIG. 13 is a vertical cross-sectional view of a step sequence in a manufacturing method of a semiconductor device according to a fifth embodiment, and illustrates a state before formation of first, third, and fourth diffusion layer regions;

FIG. 14 is a vertical cross-sectional view of a semiconductor device of related art;

FIG. 15 is a schematic view of an impurity concentration profile taken along a line A3-A4 in FIG. 14 in the semiconductor device of related art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The invention will be now described herein with reference to illustrative embodiments. Those skilled in the art will recognize that many alternative embodiments can be accomplished using the teachings of the present invention and that the invention is not limited to the embodiments illustrated for explanatory purposes. (First Embodiment} A semiconductor device according to a first embodiment of tile invention will be explained. This example describes a negative metal oxide semiconductor (nMOS) transistor. FIG. 1 is a vertical cross-sectional view of a semiconductor device according to a first embodiment.

In FIG. 1, a semiconductor substrate 1 is obtained by adding, for example, p-type impurities (such as boron) to a semiconductor at a predetermined concentration, and is fabricated from, for example, silicon. On a top face of the semiconductor substrate 1, an element isolation region (not shown) for insulating and isolating a transistor is formed in a portion other than a transistor formation region.

A lower gate insulation film 2 of silicon oxide film is formed by thermal oxidation and the like in a predetermined region (gate electrode formation region) of the transistor formation region. A gate electrode 3 is provided by forming, for example, a polycrystalline silicon layer on the lower gate insulation film 2. A phosphorous-doped polycrystalline silicon layer formed by introducing impurities during CVD growth can be used as the polycrystalline silicon layer. An upper gate insulation film 4 of such as silicon oxide film is formed on the gate electrode 3 A first side wall film 5 made from an insulation film such as silicon oxide film is formed on side walls of the gate electrode 3.

Silicon selective growth layers 10 a and 10 b are provided in a step-like (elevated) shape on the top face of the semiconductor substrate I which is not covered by the gate electrode 3, the first side wall film 5, etc. Side faces of the silicon selective growth layers 10 a and 10 b are separated from the side walls of the first side wall film 5. A gap section is provided between the silicon selective growth layers 10 a and 10 b and the first side wall film 5, and has approximately the same width as that of a second side wall film 12 described below.

First diffusion layer regions 6 a and 6 b are provided at the top face of the semiconductor substrate I on both sides of the gate electrode 3. Second diffusion layer regions 7 a and 7 b are provided in top faces of the silicon selective growth layers 10 a and 10 b. Third diffusion layer regions 8 a and 8 b are provided in side faces of the silicon selective growth layers 10 a and 10 b. The third diffusion layer regions 8 a and 8 b electrically connect the first diffusion layer regions 6 a and 6 b to the second diffusion layer regions 7 a and 7 b. Fourth diffusion layer regions 9 a and 9 b are provided around the first diffusion layer regions 6 a and 6 b. A region of semiconductor substrate between the first diffusion layer regions 6 a and 6 b becomes a channel region 11 which carriers flow through. The first diffusion layer regions 6 a and 6, the second diffusion layer regions 7 a and 7 b, and the third diffusion layer regions 8 a and 8 b are n-type impurity diffusion layers. The first diffusion layer regions 6 a and 6 b function as extension regions that constitute a lightly doped drain (LDD) structure. Therefore, the impurity concentration of the first diffusion layer regions 6 a and 6 b is preferably lower than that of the second diffusion layer regions 7 a and 7 b and the third diffusion layer regions 8 a and 8 b.

The fourth diffusion layer regions 9 a and 9 b provided around the first diffusion layer regions 6 a and 6 b are p-type impurity diffusion layers, and function as halo regions that prevent punch-through and the like. As a conventional setting selection, halo regions are not always required. If they are not required, the fourth diffusion layer regions 9 a and 9 b need not be provided.

It is general to form a halo region for a transistor aimed at miniaturization. When providing the fourth diffusion layer regions 9 a and 9 b as halo regions, the first diffusion layer regions 6 a and 6 b form a pn junction with the fourth diffusion layer regions 9 a and 9 b. Since the impurity concentration of the first diffusion layer regions 6 a and 6 b is lower than the impurity concentration of the second diffusion layer regions 7 a and 7 b, junction capacity at the pn junction can be kept low, and signal delay in the circuit where the pn junction is formed can be reduced.

In FIG. 1, the entire second diffusion layer regions 7 a and 7 b are at shallower positions than the bottoms of the silicon selective growth layers 10 a and 10 b. This positional relationship is preferable for obtaining advantages of suppressing the short-channel effect and reducing junction capacity. However, even if the concentration distribution end portions of the second diffusion layer regions 7 a and 7 b are at deeper positions than the bottoms of the silicon selective growth layers 10 a and 10 b, those advantages are not completely lost. Therefore, the impurity concentration peak positions of the second diffusion layer regions 7 a and 7 b can be set at shallower positions than the bottoms of the silicon selective growth layers 10 a and 10 b. Preferably, the third diffusion layer regions 8 a and 8 b for electrically connecting the first diffusion layer regions 6 a and 6 b to the second diffusion layer regions 7 a and 7 b are wide enough to allow that electrical connection, and are set as shallow and as high-concentration as possible. In FIG. 1, due to this positional relationship of the diffusion layers, regions surrounded by first, second, and third diffusion layer regions in the silicon selective growth layers 10 a and 10 b do not actually contain impurities. FIG. 2 is one example of an impurity concentration profile of these diffusion regions taken along a line Al-A2 in FIG. 1. In FIG. 2, the horizontal axis represents distance from top faces of the silicon selective growth layers 10 a and 10 b, and the vertical axis represents impurity concentration. A position P1 of a selective EPI growth silicon 10b and a position P2 of the top face of the silicon substrate 1 are shown on the horizontal axis of FIG. 2. FIG. 2 illustrates an impurity concentration Q1 of the first diffusion layer (n layer extension) region 6 b, an impurity concentration Q2 of the second diffusion layer (n+layer) region 7 b, and an impurity concentration Q4 of the fourth diffusion layer (p-typo Halo) region 9 b.

Although not shown in FIG. 1, there are also provided conventional interlayer insulation films, contacts penetrating through the interlayer insulation films, wirings, and so on, which are generally required in fabricating a semiconductor device.

The thickness of the silicon selective growth layers 10 a and 10 b can be selected from a range of, for example, 20 nm to 300 nm; a film thickness of approximately 100 nm can be selected as one example. While the impurity concentration of the third diffusion layer regions 8 a and 8 b can be selected relatively, such that it is between the densities of the first diffusion layer regions 6 a and 6 b and the second diffusion layer regions 7 a and 7 b, it is not limited to this range. The impurity concentration of the third diffusion layer regions 8 a and 8 b can be selected from an approximate range of, for example, 5×10¹⁸ to 1×10²¹/cm³; as one example, 8×10¹⁹ can be selected.

The depth of the third diffusion layer regions 8 a and 8 b can be selected from between, for example, approximately 10 to 80 nm.

A first manufacturing method of a semiconductor device according to a first embodiment of the invention will be explained, taking as an example the manufacturing of the semiconductor device shown in FIG. 1.

FIGS. 3 to 6 are explanatory diagrams of a first manufacturing method of a semiconductor device.

{Step 1}

As a semiconductor substrate 1, for example, a p-type silicon substrate is prepared, and an element isolation region (not shown) is formed by shallow trench isolation (STI) at a top face of his substrate. Thermal oxidation is then performed to form a gate insulation film of silicon oxide film having a thickness of, for example, 3 nm on the top face of the semiconductor substrate 1.

A phosphorous-doped silicon film as an example and a upper gate insulation film of a silicon oxide film having a thickness of, for example, 70 nm, are grown sequentially over the gate insulation film. This phosphorous-doped silicon film has a thickness of, for example, 100 nm, and its impurity concentration is 1×10²⁰/cm³. Each film is then patterned to a desired pattern, using techniques such as lithography and etching. The gate insulation film 2, the gate electrode 3, and the upper gate insulation film 4 are thus formed as shown in FIG. 3.

{Step 2}

Subsequently, for example, arsenic is introduced into the semiconductor substrate 1 by ion implantation. The conditions for ion implantation are, for example, acceleration energy of 10 keV and a dosage of 1×10¹⁴/cm². As shown in FIG. 4, this forms first diffusion layer regions (n⁻ impurity diffusion layers) 6 a and 6 b on both sides of a region corresponding to the gate electrode 3. The first diffusion layer regions 6 a and 6 b function as extension regions of an nMOS transistor.

{Step 3}

Subsequently, for example, boron is introduced into the semiconductor substrate 1 by ion implantation. The conditions for this ion implantation are, for example, acceleration energy of 10 keV and a dosage of 1×10¹³/cm². As shown in FIG. 4, this forms fourth diffusion layer regions (p-type impurity diffusion layers) 9 a and 9 b in surrounding regions beneath the first diffusion layer regions 6 a and 6 b. The fourth diffusion layer regions 9 a and 9 b function as Halo regions of the nMOS transistor.

{Step 4}

Subsequently, for example, a silicon oxide film having a thickness of 8 nm and a silicon nitride film having a thickness of 20 nm are grown on the semiconductor substrate 1 such as to cover the gate insulation film 2, the gate electrode 3, and the upper gate insulation film 4. The silicon oxide film and the silicon nitride film are then processed by etching back. As shown in FIG. 5, a side wall spacer (side wall) 13 including a first side wall film 5 and a second side wall film 12 is thereby formed on side walls of the gate electrode 3 and the upper gate insulation film 4. The silicon oxide film can be formed by thermal oxidation of side faces of the gate electrode 3 before forming the first diffusion layer regions 6 a and 6 b and the fourth diffusion layer regions 9 a and 9 b. {Step 5}

Subsequently, silicon selective growth layers 10 a and 10 b with a thickness of, for example, 100 nm are selectively formed on an exposed top face of the semiconductor substrate 1, using selective epitaxial growth.

{Step 6}

Subsequently, for example, boron is introduced into the silicon selective growth layers 10 a and 10 b by ion implantation. The conditions for ion implantation are, for example, acceleration energy of 10 keV and a dosage of 1×10¹⁵/cm². As shown in FIG. 5, his forms second diffusion layer regions (n⁺ impunity diffusion layers) 7 a and 7 b. The second diffusion layer regions 7 a and 7 b function as a source region and a drain region of the nMOS transistor. [on implantation to form the second diffusion layer regions 7 a and 7 b is preferably performed under conditions (e.g. the abovementioned conditions) such that the n-type impurity is diffused only in portions near the top face of the silicon selective growth layers 10 a and 10 b, and does not reach the top face of the semiconductor substrate 1.

{Step 7}

Subsequently, the second side wall film 12 is removed by, for example, wet etching using phosphoric acid. As shown in FIG. 6, this forms a gap section 14 between the first side wall film 5 and the silicon selective growth layers 10 a and 10 b.

{Step 8}

Subsequently, using the gap section 14, boron or phosphorous is introduced to top faces and side faces of the silicon selective growth layers 10 a and 10 b using plasma doping such that the impurity concentration at the side faces is, for example, 1×10¹⁹/cm³. As shown in FIG. 6, this forms third diffusion layer regions (n impurity diffusion layers) 8 a and 8 b near side faces of the silicon selective growth layers 10 a and 10 b Impurities are introduced onto the top face in this step, and this region overlaps with the second diffusion layer regions 7 a and 7 b. For simplicity, therefore, it will not be explained. Only the diffusion layer regions on side faces of the silicon selective growth layers 10 a and 10 b are deemed as the third diffusion layer regions 8 a and 8 b.

In addition to plasma doping, another method, such as rotation-tilt ion implantation, can be used to form the third diffusion layer regions 8 a and 8 b. Nonetheless, use of plasma doping is preferable when the gap section 14 between the first side wall film 5 and the silicon selective growth layers 10 a and 10 b is small due to miniaturization, when the vertical cross-sectional shape of the silicon selective growth layers 10 a and 10 b is an overhang, and other such cases. After forming the diffusion layer regions in this manner, interlayer films, contact plugs, wirings and the like are fabricated to obtain a semiconductor device. Thermal processing is performed as appropriate, e.g. activate thermal processing, and thermal processing after interlayer film formation.

Second Embodiment

A semiconductor device according to a second embodiment of the invention will be explained. In a second embodiment, constituent parts that are similar to those in the first embodiment will not be explained. FIG. 7 is a vertical cross-sectional view of a semiconductor device in a second embodiment.

The semiconductor device of the second embodiment is similar to the semiconductor device of the first embodiment except that second diffusion layer regions 7 a and 7 b are formed at the same time as third diffusion layer regions 8 a and 8 b.

In the semiconductor device of the second embodiment, {Step 6} described above is omitted by introducing impurities into the silicon selective growth layers 10 a and 10 b during {Step 8} described above. To simplify explanation, of the impurity diffusion layers at side faces and top faces of the silicon selective growth layers 10 a and 10 b formed in this {Step 8}, only top face parts are made into second diffusion layer regions 7 a and 7 b. Therefore, the number of steps in the second embodiment can be made fewer than in the first embodiment, enabling the manufacturing cost to be reduced.

Third Embodiment

A semiconductor device according to a third embodiment of the invention will be explained. In the third embodiment, constituent parts that are similar to those in the first and second embodiments will not be repetitiously explained. FIG. 8 is a vertical cross-sectional view of a semiconductor device in a third embodiment.

A feature of the semiconductor device of the third embodiment, in comparison with the second embodiment, is that the first disunion layer regions 6 a and 6 b are provided only near the bottom of the first side wall film. Although not shown in the drawings, the first diffusion layer regions 6 a and 6 b can also be similarly arranged in the semiconductor device of the first embodiment.

To manufacture the semiconductor device of the third embodiment, the steps of manufacturing the semiconductor device of the second embodiment are modified as follows. {Step 2} described in the steps of manufacturing the semiconductor device of the second embodiment is omitted. Instead, during the stage where the gap section 14 exists between the first side wall film 5 and the silicon selective growth layers 10 a and 10 b as described in {Step 7} (e.g. the stage shown in FIG. 9), boron is introduced through the first side wall film 5 by ion implantation with an acceleration energy of for example, 10 to 25 keV. This forms he first diffusion layer regions 6 a and 6 b shown in FIG. 8. The semiconductor device of the third embodiment is thus manufactured.

Impurities are also introduced by ion implantation to the top faces of the silicon selective growth layers 10 a and 10 b, and this region overlaps with the second diffusion layer regions 7 a and 7 b Therefore, for simplicity of explanation, only regions near the bottom of the first side wall film are made into first diffusion layer regions 6 a and 6 b.

In the third embodiment in particular, it is possible to reduce the area of the pn junction formed by the first diffusion layer regions 6 a and 6 b and the fourth diffusion layer regions 9 a and 9 b. The pn junction capacity can thereby be further reduced, and so can circuit signal delay.

Fourth Embodiment

A semiconductor device according to a fourth embodiment of the invention will be explained. In the fourth embodiment, constituent parts that are similar to those in the first to third embodiments will not be repetitiously explained.

FIG. 10 is a vertical cross-sectional view of a semiconductor device in a fourth embodiment.

In comparison with the third embodiment, the semiconductor device of the fourth embodiment has the following features. The first side wall film 5 is removed. The first diffusion layer regions 6 a and 6 b are formed in the same ion implantation step as the second diffusion layer regions 7 a arid 7 b and the third diffusion layer regions 8 a and 8 b.

Steps of manufacturing the semiconductor device of the fourth embodiment modify the steps of manufacturing the semiconductor device of the third embodiment as follows. The step of forming the first diffusion layer regions 6 a and 6 b by ion implantation in the third embodiment is omitted. Also, in the stage shown in FIG. 9, {Step 8} is performed after removing the first side wall film 5 by wet etching. Thus the semiconductor device of the fourth embodiment can be manufactured.

Fifth Embodiment

A semiconductor device according to a fifth embodiment of the invention will be explained. In the fifth embodiment, constituent parts that are similar to those in the first to fourth embodiments will not be repetitiously explained.

FIG. 12 is a vertical cross-sectional view of a semiconductor device in a fifth embodiment.

In comparison with the fourth embodiment, the semiconductor device of the fifth embodiment has the follow features. The fourth diffusion layer regions 9 a and 9 b exist only near both sides of the gate electrode 3. Another feature is that the second diffusion layer regions 7 a and 7 b described in the first embodiment are employed.

Steps of manufacturing the semiconductor device of the fifth embodiment modify the steps of manufacturing the semiconductor device of the fourth embodiment as follows. {Step 3} is omitted, while {Step 6} is not omitted and is performed as in the first embodiment. Also, when performing {Step 8} (FIG. 13), the fourth diffusion layer regions 9 a and 9 b are formed near both sides of the gate electrode 3 by, for example, boron ion implantation. Thus the semiconductor device of the fit embodiment can be manufactured.

Impurities are also introduced by ion implantation into top faces of the silicon selective growth layers 10 a and 10 b, these regions overlapping with the second diffusion layer regions 7 a and 7 b; in addition, the impurity concentration of the fourth diffusion layer that generally functions as a halo is comparatively lower than the impurity concentration of the second diffusion layer regions 7 a and 7 b which are n⁺ regions. Therefore, to simplify explanation, only regions near both sides of the gate electrode 3 are made into fourth diffusion layer regions 9 a and 9 b.

In the fifth embodiment, the fourth diffusion layer regions 9 a and 9 b are fabricated only near both sides of the gate electrode 3. Therefore, even if the end of the impurity distribution of the second diffusion layer regions 7 a and 7 b is formed deeper than We silicon selective growth layers 10 a and 10 b by thermal processing and the like, the junction capacity does not increase. As a result, signal delay in the circuit can be kept low.

Specific embodiments of the semiconductor device of the invention and a manufacturing method thereof have been explained. In these embodiments, the materials for constituting the semiconductor device, their thicknesses, and formation methods are merely examples, it being possible to make modifications without deviating from the scope of the invention. For example in the third and fourth embodiments, the second diffusion layer regions can be provided as in the first embodiment. While in each of the embodiments described above, the transistor that constitutes the semiconductor device is an n-channel type, a p-channel type transistor can be used instead.

INDUSTRIAL APPLICABILITY

The present invention can be applied in, for example, any semiconductor device that includes a transistor. 

1. A semiconductor device comprising: a semiconductor substrate; a pair of first diffusion layer regions provided near a top face of said semiconductor substrate; a channel region provided between said first diffusion layer regions of said semiconductor substrate; a gate insulation film provided on said channel region and on said semiconductor substrate such as to overlap with at least part of said first diffusion layer regions; a gate electrode provided on said insulation film; a pair of silicon selective growth layers provided on said semiconductor substrate at both sides of said gate electrode, each of said pair of silicon selective growth layers overlapping with at least part of said first diffusion layer regions, and being provided at a distance from said gate electrode; second diffusion layer regions provided in each of said silicon selective growth layers, peak positions of impurity concentration of said second diffusion layer regions being shallower than bottoms of said silicon selective growth layers; and third diffusion layer regions provided near side faces of said silicon selective growth layers, and electrically connecting said first diffusion layer regions to said second diffusion layer regions.
 2. The semiconductor device according to claim 1, wherein positions of entire said second diffusion layer regions are shallower than bottoms of said silicon selective growth layers.
 3. The semiconductor device according to claim 1, further comprising fourth diffusion layer regions around said first diffusion layer regions, said fourth diffusion layer regions including an impurity of an opposite conductive type to said first diffusion layer regions.
 4. A semiconductor device manufacturing method comprising: forming first diffusion layer regions at a semiconductor substrate on which a gate electrode provided with a gate insulation film and an upper gate insulation film are formed, in regions corresponding to both sides of said gate electrode; forming side walls on side faces of said gate electrode; forming step-like silicon selective growth layers on said semiconductor substrate at both sides of said gate electrode such that said silicon selective growth layers are adjacent to said side walls; forming second diffusion layer regions having a same conductive type as said first diffusion layer regions at top faces of said silicon selective growth layers, such that at least peak positions of impurity concentrations of said second diffusion layer regions are shallower than bottoms of said silicon selective growth layers; removing at least part of said side walls to form gap sections along side faces of said silicon selective growth layers; and forming third diffusion layer regions having a same conductive type as said first and second diffusion layer regions near side faces of said silicon selective growth layers, via said gap sections.
 5. The semiconductor device manufacturing method according to claim 4, further comprising forming fourth diffusion layer regions around said first diffusion layer regions, said fourth diffusion layer regions of an opposite conductive type to said first, second and third diffusion layer regions.
 6. The semiconductor device manufacturing method according to claim 4, wherein plasma doping is used when forming said third diffusion layer regions.
 7. The semiconductor device manufacturing method according to claim 4, wherein rotation-tilt ion implantation is used when forming said third diffusion layer regions.
 8. A semiconductor device manufacturing method comprising: forming first diffusion layer regions at a semiconductor substrate on which a gate electrode provided with a gate insulation film and an upper gate insulation film are formed, in regions corresponding to both sides of said gate electrode; forming side walls on side faces of said gate electrode; forming step-like silicon selective growth layers on said semiconductor substrate at both sides of said gate electrode such that said silicon selective growth layers are adjacent to said side walls; removing at let part of said side wails to form gap sections along side faces of said silicon selective growth layers; and forming second diffusion layer regions having a same conductive type as said first diffusion layer regions near top faces of said silicon selective growth layers, and third diffusion layer regions having the same conductive type as said first diffusion layer regions at side faces of said silicon selective growth layers, simultaneously.
 9. The semiconductor device manufacturing method according to claim 8, further comprising forming fourth diffusion layer regions around said first diffusion layer regions, said fourth diffusion layer regions of an opposite conductive type to said first, second and third diffusion layer regions.
 10. A semiconductor device manufacturing method comprising: forming side walls on side faces of a gate electrode provided with a gate insulation film and an upper gate insulation films said gate electrode formed on a semiconductor substrate; forming step-like silicon selective growth layers on said semiconductor substrate at both sides of said gate electrode such that said silicon selective growth layers are adjacent to said side walls; removing at least part of said side walls to form gap sections along side faces of said silicon selective growth layers; forming a first diffusion layer region only below said side walls via said gap sections; and forming second diffusion layer regions having a same conductive type as said first diffusion layer regions near top faces of said silicon selective growth layers, and third diffusion layer regions having the same conductive type as said first diffusion layer regions at side faces of said silicon selective growth layers, simultaneously.
 11. The semiconductor device manufacturing method according to claim 10, further comprising forming fourth diffusion layer regions around said first diffusion layer regions, said fourth diffusion layer regions of an opposite conductive type to said first, second and third diffusion layer regions.
 12. A semiconductor device manufacturing method comprising: forming side walls on side faces of a gate electrode provided with a gate insulation film and an upper gate insulation film, said gate electrode formed on a semiconductor substrate; forming step-like silicon selective growth layers on said semiconductor substrate at both sides of said gate electrode such that said silicon selective growth layers are adjacent to said side walls; removing said side walls completely; and forming first diffusion layer regions at a face of said semiconductor substrate corresponding to positions of said removed side walls, second diffusion layer regions having a same conductive type as said first diffusion layer regions near top faces of said silicon selective growth layers, and third diffusion layer regions having the same conductive type as said first diffusion layer regions at side faces of said silicon selective growth layers, simultaneously.
 13. The semiconductor device manufacturing method according to claim 12, further comprising forming fourth diffusion layer regions around said first diffusion layer regions, said fourth diffusion layer regions of an opposite conductive type to said first, second and third diffusion layer regions.
 14. A semiconductor device manufacturing method comprising: forming side walls on side faces of a gate electrode provided with a gate insulation film and an upper gate insulation film, said gate electrode formed on a semiconductor substrate; forming step-like silicon selective growth layers on said semiconductor substrate at both sides of said gate electrode such that silicon selective growth layers are adjacent to said side walls; forming second diffusion layer regions at a top face of said silicon selective growth layers, such that at least peak positions of impurity concentration of said second diffusion layer regions are shallower than bottoms of said silicon selective growth layers; removing said side walls completely; forming fourth diffusion layer regions having an opposite conductive type to said second diffusion layer regions, at a face of said semiconductor substrate corresponding to positions of said removed side walls, forming first diffusion layer regions having a same conductive type as said second diffusion layer regions at a shallow depth than said fourth diffusion layer regions at the face of said semiconductor substrate corresponding to the positions of said removed side walls, and third diffusion layer regions having the same conductive type as said second diffusion layer regions at side faces of said silicon selective growth layers, simultaneously. 